FPC-BUND - Development Kit / Prototype Bundle
Development Kit / Prototype Bundle for the Fingerprint Cards FPC-AM3 Biometric Fingerprint Area Sensor Module

The FPC-AMD3 is a Development Kit / Prototype bundle that includes all necessary components for developing and prototyping a new fingerprint product. Hardware, software and documentation is all included.

The FPC-Bund comprises 1 x FPC-AMD3 development kit and 1 x FPC-AMP3 prototype kit ( which comprises 5 x FPC-AM3 modules )

Products related to the FPC-BUND

Below are the products related to the FPC-BUND - select a link to view the particular product page.

FPC-AM3
Biometric sub-system, Easy integration, Minimal time-to-market, Small size, Rugged protective sensor coating, One-To-One verification / One-To-Many identification, 991 template storage onboard, Serial command interface, Download / Upload template function Area Sensor Biometric Fingerprint Module